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119 نتيجة لـ "news-in-brief-31-12-2024-2253120ar"
HONOR X6B 4/128
Network Technology GSM / HSPA / LTE Launch Announced 2024, June 13 Status Available. Released 2024, June Body Dimensions 163.6 x 75.3 x 8.4 mm (6.44 x 2.96 x 0.33 in) Weight 192 g (6.77 oz) SIM Nano-SIM + Nano-SIM Display Type TFT LCD, 90Hz, 780 nits (peak) Size 6.56 inches, 103.4 cm2 (~83.9% screen-to-body ratio) Resolution 720 x 1612 pixels, 20:9 ratio (~269 ppi density) Always-on display Platform OS Android 14, Magic OS 8 Chipset Mediatek Helio G85 (12 nm) CPU Octa-core (2x2.0 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55) GPU Mali-G52 MC2 Memory Card slot microSDXC Internal 128GB 4GB RAM, Main Camera Dual 50 MP, f/1.8, (wide), PDAF 2 MP, f/2.4, (depth) Features LED flash, HDR, panorama Video Selfie camera Single 5 MP, f/2.2, (wide) Video Sound Loudspeaker Yes 3.5mm jack Yes Comms WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct Bluetooth 5.1, A2DP, LE, aptX HD Positioning GPS, GLONASS, GALILEO, BDS NFC Yes (JDY-LX1 only) Radio No USB USB Type-C 2.0, OTG Features Sensors Fingerprint (side-mounted), accelerometer, proximity Battery Type Li-Po 5200 mAh Charging 35W wired, 31% in 20 min
HONOR X6B 6/256
Network Technology GSM / HSPA / LTE Launch Announced 2024, June 13 Status Available. Released 2024, June Body Dimensions 163.6 x 75.3 x 8.4 mm (6.44 x 2.96 x 0.33 in) Weight 192 g (6.77 oz) SIM Nano-SIM + Nano-SIM Display Type TFT LCD, 90Hz, 780 nits (peak) Size 6.56 inches, 103.4 cm2 (~83.9% screen-to-body ratio) Resolution 720 x 1612 pixels, 20:9 ratio (~269 ppi density) Always-on display Platform OS Android 14, Magic OS 8 Chipset Mediatek Helio G85 (12 nm) CPU Octa-core (2x2.0 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55) GPU Mali-G52 MC2 Memory Card slot microSDXC Internal 256GB 6GB RAM Main Camera Dual 50 MP, f/1.8, (wide), PDAF 2 MP, f/2.4, (depth) Features LED flash, HDR, panorama Video 1080p@30fps Selfie camera Single 5 MP, f/2.2, (wide) Video 1080p@30fps Sound Loudspeaker Yes 3.5mm jack Yes Comms WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct Bluetooth 5.1, A2DP, LE, aptX HD Positioning GPS, GLONASS, GALILEO, BDS NFC Yes (JDY-LX1 only) Radio No USB USB Type-C 2.0, OTG Features Sensors Fingerprint (side-mounted), accelerometer, proximity Battery Type Li-Po 5200 mAh Charging 35W wired, 31% in 20 min
HONOR X6B 6/128
Network Technology GSM / HSPA / LTE Launch Announced 2024, June 13 Status Available. Released 2024, June Body Dimensions 163.6 x 75.3 x 8.4 mm (6.44 x 2.96 x 0.33 in) Weight 192 g (6.77 oz) SIM Nano-SIM + Nano-SIM Display Type TFT LCD, 90Hz, 780 nits (peak) Size 6.56 inches, 103.4 cm2 (~83.9% screen-to-body ratio) Resolution 720 x 1612 pixels, 20:9 ratio (~269 ppi density) Always-on display Platform OS Android 14, Magic OS 8 Chipset Mediatek Helio G85 (12 nm) CPU Octa-core (2x2.0 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55) GPU Mali-G52 MC2 Memory Card slot microSDXC Internal , 128GB 6GB RAM, Main Camera Dual 50 MP, f/1.8, (wide), PDAF 2 MP, f/2.4, (depth) Features LED flash, HDR, panorama Video 1080p@30fps Selfie camera Single 5 MP, f/2.2, (wide) Video 1080p@30fps Sound Loudspeaker Yes 3.5mm jack Yes Comms WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct Bluetooth 5.1, A2DP, LE, aptX HD Positioning GPS, GLONASS, GALILEO, BDS NFC Yes (JDY-LX1 only) Radio No USB USB Type-C 2.0, OTG Features Sensors Fingerprint (side-mounted), accelerometer, proximity Battery Type Li-Po 5200 mAh Charging 35W wired, 31% in 20 min
REALME C63 4G 8/256
Network Technology GSM / HSPA / LTE Launch Announced 2024, May 31 Status Available. Released 2024, June 05 Body Dimensions 167.3 x 76.7 x 7.7 mm (6.59 x 3.02 x 0.30 in) Weight 189 g or 191 g (6.67 oz) Build Glass front, plastic back or silicone polymer back (eco leather), plastic frame SIM Dual SIM (Nano-SIM, dual stand-by) IP54, dust and splash resistant Display Type IPS LCD, 90Hz, 560 nits (HBM) Size 6.75 inches, 110.0 cm2 (~85.7% screen-to-body ratio) Resolution 720 x 1600 pixels, 20:9 ratio (~260 ppi density) Platform OS Android 14, Realme UI 5.0 Chipset Unisoc Tiger T612 (12 nm) CPU Octa-core (2x1.8 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55) GPU Mali-G57 Memory Card slot microSDXC (dedicated slot) Internal 256GB 8GB RAM Main Camera Single 50 MP, f/1.8, (wide), 1/2.5", PDAF Auxiliary lens Features LED flash, panorama Video Selfie camera Single 8 MP, f/2.0, (wide), 1/4.0" Video Sound Loudspeaker Yes, with dual speakers 3.5mm jack Yes Comms WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Bluetooth 5.0, A2DP, LE Positioning GPS, GALILEO, GLONASS, BDS NFC Yes (market/region dependent) Radio Unspecified USB USB Type-C 2.0 Features Sensors Fingerprint (side-mounted), accelerometer, gyro, proximity, compass Battery Type 5000 mAh, non-removable Charging 45W wired
REALME C63 6/128
Network Technology GSM / HSPA / LTE Launch Announced 2024, May 31 Status Available. Released 2024, June 05 Body Dimensions 167.3 x 76.7 x 7.7 mm (6.59 x 3.02 x 0.30 in) Weight 189 g or 191 g (6.67 oz) Build Glass front, plastic back or silicone polymer back (eco leather), plastic frame SIM Dual SIM (Nano-SIM, dual stand-by) IP54, dust and splash resistant Display Type IPS LCD, 90Hz, 560 nits (HBM) Size 6.75 inches, 110.0 cm2 (~85.7% screen-to-body ratio) Resolution 720 x 1600 pixels, 20:9 ratio (~260 ppi density) Platform OS Android 14 Chipset Unisoc Tiger T612 (12 nm) CPU Octa-core (2x1.8 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55) GPU Mali-G57 Memory Card slot microSDXC (dedicated slot) Internal 128GB 6GB RAM, Main Camera Single 50 MP, f/1.8, (wide), 1/2.5", PDAF Auxiliary lens Features LED flash, panorama Video 1080p@30fps Selfie camera Single 8 MP, f/2.0, (wide), 1/4.0" Video 720p@30fps Sound Loudspeaker Yes 3.5mm jack Yes Comms WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Bluetooth 5.0, A2DP, LE Positioning GPS, GALILEO, GLONASS, BDS NFC Yes (market/region dependent) Radio Unspecified USB USB Type-C 2.0 Features Sensors Fingerprint (side-mounted), accelerometer, gyro, proximity, compass Battery Type 5000 mAh Charging 45W wired
CARTE MERE TUF GAMING B760M-PLUS II
Model TUF GAMING B760M-PLUS II News & Updates 2024/08/12: The new BIOS with Intel microcode (0x129) enhancing the stability of Intel Core 13th and 14th Gen desktop processors is now available. Please visit support site for the latest BIOS updates. CPU Intel® Socket LGA1700 for Intel® Core™ 14th & 13th Gen Processors, Intel® Core™ 12th Gen, Pentium® Gold and Celeron® Processors* Supports Intel® Turbo Boost Technology 2.0 and Intel® Turbo Boost Max Technology 3.0** * Refer to for CPU support list. ** Intel® Turbo Boost Max Technology 3.0 support depends on the CPU types. Chipset Intel® B760 Chipset Memory 4 x DIMM slots, Max. 192GB, DDR5 7800+(OC)/7600(OC)/7400(OC)/7200(OC)/7000(OC)/6800(OC)/6600(OC)/6400(OC)/ 6200(OC)/ 6000(OC)/ 5800(OC)/ 5600/ 5400/ 5200/ 5000/ 4800 Non-ECC, Un-buffered Memory* Dual channel memory architecture Supports Intel® Extreme Memory Profile (XMP) ASUS Enhanced Memory Profile II (AEMP II) * Supported memory types, data rate (speed), and number of DRAM modules vary depending on the CPU and memory configuration, for more information please refer to CPU/Memory Support list under the Support tab of product information site or visit /. * Non-ECC, un-buffered DDR5 memory supports On-Die ECC function. Graphics 1 x DisplayPort** 1 x HDMI™ port*** * Graphics specifications may vary between CPU types. Please refer to for any updates. ** Supports max. as specified in DisplayPort 1.4. ***Supports as specified in HDMI 2.1. **** VGA resolution support depends on processors' or graphic cards' resolution. Expansion Slots Intel®Core™Processors (14th& 13th& 12th Gen)* 1 x PCIe 5.0 x16 slot Intel®B760 Chipset 1 x PCIe 4.0 x4 slot 1 x PCIe 3.0 x1 slot - To ensure compatibility of the device installed, please refer to / for the list of supported peripherals. Storage Supports 3 x M.2 slots and 4 x SATA 6Gb/s ports* Intel®Core™Processors (14th& 13th& 12th Gen) M.2_1 slot (Key M), type 2242/2260/2280(supports PCIe 4.0 x4 mode) Intel®B760 Chipset** M.2_2 slot (Key M), type 2242/2260/2280 (supports PCIe 4.0 x4 mode) M.2_3 slot (Key M), type 2242/2260/2280 (supports PCIe 4.0 x2 mode) 4 x SATA 6Gb/s ports**** * Intel® Rapid Storage Technology supportsSATA RAID 0/1/5/10. Ethernet 1 x Realtek 2.5Gb Ethernet TUF LANGuard USB Rear USB (Total 8 ports) 1 x USB 20Gbps port (1 x USB Type-C®) 1 x USB 10Gbps port (1 x Type-A) 2 x USB 5Gbps ports (2 x Type-A) 4 x USB 2.0 ports (4 x Type-A) Front USB (Total 8 ports) 1 x USB 10Gbps connector (supports USB Type-C®)* 1 x USB 5Gbps header supports 2 additional USB 5Gbps ports 3 x USB 2.0 headers support 5 additional USB 2.0 ports Audio Realtek 7.1 Surround Sound High Definition Audio CODEC - Supports: Jack-detection, Multi-streaming, Front Panel Jack-retasking - Supports up to 24-Bit/192 kHz playback Audio Features - Audio Shielding - Rear optical S/PDIF out port - Premium audio capacitors - Dedicated audio PCB layers Back Panel I/O Ports 1 x USB 20Gbps port (1 x USB Type-C®) 1 x USB 10Gbps port (1 x Type-A) 2 x USB 5Gbps ports (2 x Type-A) 4 x USB 2.0 ports (4 x Type-A) 1 x DisplayPort 1 x HDMI™ port 1 x Realtek 2.5Gb Ethernet port 5 x Audio jacks 1 x Optical S/PDIF out port Internal I/O Connectors Fan and Cooling Related 1 x 4-pin CPU Fan header 1 x 4-pin CPU OPT Fan header 1 x 4-pin AIO Pump header 3 x 4-pin Chassis Fan headers Power Related 1 x 24-pin Main Power connector 2 x 8-pin +12V Power connectors Storage Related 3 x M.2 slots (Key M) 4 x SATA 6Gb/s ports USB 1 x USB 10Gbps connector (supports USB Type-C®) 1 x USB 5Gbps header supports 2 additional USB 5Gbps ports 3 x USB 2.0 headers support 5 additional USB 2.0 ports Miscellaneous 3 x Addressable Gen 2 headers 1 x Clear CMOS header 1 x Front Panel Audio header (F-AUDIO) 1 x20-3 pin System Panel header with chassis intrusion function 1 x Thunderbolt™ (USB4®) header Special Features ASUS TUF PROTECTION - DIGI+ VRM (- Digital power design with DrMOS) - ESD Guards - TUF LANGuard - Overvoltage Protection - SafeSlot Core+ - Stainless-steel back I/O ASUS Q-Design - M.2 Q-Latch - PCIe Slot Q-Release - Q-DIMM - Q-LED (CPU [red], DRAM [yellow], VGA [white], Boot Device [yellow green]) ASUS Thermal Solution - M.2 heatsinks - VRM heatsink design ASUS EZ DIY - CPU Socket lever protector - ProCool - Pre-mounted I/O shield - SafeDIMM Aura Sync - Addressable Gen 2 headers Software Features ASUS Exclusive Software Armoury Crate - AURA Creator - AURA Sync - Fan Xpert 2+ - Power Saving - Two-Way AI Noise Cancelation AI Suite 3 - DIGI+ VRM - PC CleanerTUF GAMING CPU-Z DTS Audio Processing Norton 360 for Gamers (60 Days Free Trial) WinRAR (40 Days Free Trial) UEFI BIOS ASUS EZ DIY - ASUS CrashFree BIOS 3 - ASUS EZ Flash 3 - ASUS UEFI BIOS EZ Mode BIOS 128 Mb Flash ROM, UEFI AMI BIOS Manageability WOL by PME, PXE Accessories Cables 2 x SATA 6Gb/s cables Miscellaneous 1 x M.2 rubber package 1 x TUF GAMING sticker 2 x Screw packages for M.2 SSD Documentation 1 x TUF certification card 1 x Quick start guide Operating System Windows®11, Windows®10 64-bit Form Factor micro-ATX Form Factor 9.6 inch x 9.6 inch (24.4 cm x 24.4 cm)